TIA Standards developed by committee CE-3.0

CB5 - Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
CB5-1 - Addendum to Bulletin CB5
EIA/IS-701 - Production Ball Grid Array (BGA) Socket Test Specification
EIA-5400000-A - Generic Specification for Sockets for Use in Electronic Equipment (ANSI/EIA-5400000-A-96)
EIA-5400BAA - Detail Specification for Decoupling Capacitor Dual In-Line Package Sockets for Use in Electronic Equipment (ANSI/EIA-5400BAA-94) (R97)
EIA-540A000-A - Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment (ANSI/EIA-540A000-A-90) (R97)
EIA-540AA00 - Blank Detail Specification for Chip Carrier Sockets for Leadless Type A, B, or D Chip Carriers for Use in Electronic Equipment (ANSI/EIA-540AA00-91)
EIA-540AAAA - Detail Specification for Chip Carrier Sockets for Leadless Type A [1.27 mm (0.050 in)] Spacing Chip Carriers for Use in Electronic Equipment (ANSI/EIA-540AAAA-90)
EIA-540AB00 - Blank Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Packages for Use in Electronic Equipment (ANSI/EIA-540AB00-91)
EIA-540ABAA - Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (0.025 in) Lead Spacing (Gullwing) (ANSI/EIA-540ABAA-91)
EIA-540AC00 - Blank Detail Specification for Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with "J" Type Leads for Use in Electronic Equipment (ANSI/EIA-540AC00-91)
EIA-540ACAA - Detail Specification for Plastic Chip Carrier (PCC) Family 1.27 mm (0.050 in) Lead Spacing (ANSI/EIA-540ACAA-91)
EIA-540AD00 - Blank Detail Specification for Adaptor Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment (ANSI/EIA-540AD00-91)
EIA-540ADAA - Detail Specification for Adaptor Carrier Quad Flatpack to Pin Grid Array Sockets for Use in Electronic Equipment (ANSI/EIA-540ADAA-92) (R98)
EIA-540B000 - Sectional Specification: Sockets for Pin Grid Array Devices with 2.54 mm x 2.54 mm (0.1in x 0.1in) Spacing for Use in Electronic Equipment (ANSI/EIA-540B000-89)
EIA-540B0AA - Detail Specification for Production Ball Grid Array (BGA) Sockets with 1.27 mm (0.050 in) Spacing for Use in Electronic Equipment (ANSI/EIA-540B0AA-97)
EIA-540BA00 - Blank Detail Specification: Sockets for Pin Grid Array Devices with 2.54 mm x 2.54 mm (0.1 in x 0.1 in) Spacing for Use in Electronic Equipment (ANSI/EIA-540BA00-90)
EIA-540BAAA-A - Detail Specification for Mechanically Actuated (Zero and Low Insertion Force) Sockets for Pin Grid Array Devices with 2.54 mm x 2.54 mm (0.1 in x 0.1 in) Spacing for Use in Electronic Equipment (ANSI/EIA-540BAAA-A-96)
EIA-540BAAB - Detail Specification for Non-Mechanically Actuated Sockets for Pin Grid Array Devices with 2.54 mm x 2.54 mm (0.1 in x 0.1 in) Spacing for Use in Electronic Equipment (ANSI/EIA-540BAAB-90)
EIA-540BAAC - Detail Specification for Non-Mechanically Actuated Flexible Carrier Sockets for Pin Grid Array Devices for Use in Electronic Equipment (ANSI/EIA-540BAAC-91)
EIA-540C000 - Sectional Specification, Sockets for Relays for use in Electronic Equipment (ANSI/EIA-540C000-88) (R96)
EIA-540CA00 - Blank Detail Specification on Relay Sockets (ANSI/EIA-540CA00-1989) (R96)
EIA-540CAAA - Detail Specification on Relay Socket - 10 A for Balanced Armature Relay (ANSI/EIA-540CAAA-89) (R96)
EIA-540CAAB - Detail Specification on Relay Sockets - 5 A for Balanced Armature Relay (ANSI/EIA-540CAAB-1989) (R96)
EIA-540CAAC-A - Detail Specification for 2 Pole, 10 A Relay Sockets
EIA-540CAAD-A - Detail Specification for 2 Pole, 5 A Relay Sockets (ANSI/EIA-540CAAD-A-99)
EIA-540CAAE-A - Detail Specification for 3 Pole, 10 A Relay Sockets (ANSI/EIA-540CAAE-99)
EIA-540D000-A - Sectional Specification for In-Line Package Sockets for Use in Electronic Equipment (ANSI/EIA-540D000-A-91)
EIA-540DA00 - Blank Detail Specification for Dual In-Line Sockets for Use in Electronic Equipment (ANSI/EIA-540DA00-91)
EIA-540DAAA-A - Detail Specification for Dual-In-Line 2 Piece Contact Socket for Use in Electronic Equipment (ANSI/EIA-540DOAA-A-91)
EIA-540DAAB - Detail Specification for Flexible Carrier 2 Piece Dual In-Line Sockets for Use in Electronic Equipment (ANSI/EIA-540DAAB-91)
EIA-540DB00 - Blank Detail Specification for Decoupling Capacitor Dual In-Line Package Sockets (ANSI/EIA-540D00-92) (R99)
EIA-540DBAA - Detail Specification for Decoupling Capacitor Dual In-Line Package Sockets for Use in Electronic Equipment (ANSI/EIA-540DBAA-94) (R99)
EIA-540E000 - Sectional Specification for Round-Style Sockets for Use in Electronic Equipment (ANSI/EIA-540E000-92) (R99)
EIA-540EA00 - Blank Detail Specification for Round Style Sockets (ANSI/EIA-540EA00-97)
EIA-540EAAA - Detail Specification for Round Style Sockets (ANSI/EIA-540EAAA-97)
EIA-540F000 - Sectional Specification for Multi-Package Module Sockets for Use in Electronic Equipment (ANSI/EIA-540F000-91)
EIA-540FA00 - Blank Detail Specification for Multi-Package Module Sockets for Use in Electronic Equipment (ANSI/EIA-540FA00-92)
EIA-540FAAA - Detail Specification for Multi-Package 100 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment (ANSI/EIA-540FAAA-92) (R98)
EIA-540FAAB - Detail Specification for Multi-Package 100 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment (ANSI/EIA-540FAAB-92) (R98)
EIA-540FAAC - Detail Specification for Multi-Package 50 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment (ANSI/EIA-540FAAC-92)
EIA-540FAAD - Detail Specification for Multi-Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment (ANSI/EIA-540FAAD-92)
EIA-540G000 - Sectional Specification for Burn-In Sockets for Use in Electronic Equipment (ANSI/EIA-540G000-93)
EIA-540GA00 - Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment (ANSI/EIA-540GA00-93)
EIA-540GAAA - Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment (ANSI/EIA-540GAAA-93)
EIA-540H000 - Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment (ANSI/TIA/EIA-540H000-97)
EIA-540HA00 - Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment (ANSI/EIA-540HA00-00)
EIA-674 - Specification for Small Form Factor 45.7 mm (1.8 in) Disk Drives (ANSI/EIA-674-96)
EIA-675 - Specification for Small Form Factor 33.0 (1.3 in) Disk Drives (ANSI/EIA-675-96)
EIA-676 - Specification for Small Form Factor 45.7 mm (1.8 in) Disk Drives, 15 mm (0.59 in) High (ANSI/EIA-676-96)
EIA-677 - Specification for Small Form Factor Power Connector Pin Dimensions (ANSI/EIA-677-97)
EIA-700A0AB - Detail Specification for 1.27 mm Pitch, 68 Circuit Memory Card Interconnect System (ANSI/EIA-700A0AB-95)
EIA-700A0AC - Detail Specification for 1.00 mm Pitch, 88 Circuit Dram Memory Card Interconnect System (ANSI/EIA-700A0AC-96)
EIA-720 - EIA Specification for Small Form Factor 63.5 mm (2.5 in) Disk Drives (ANSI/EIA-720-97)
EIA-740 - Specification for Small Form Factor 88.9 mm (3.5 in) Disk Drives