TIA Standards developed by committee JC-15.01

JESD51-3 - Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-4 - Thermal Test Chip Guideline (Wire Bond Type Chip)
JESD51-6 - Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board