TIA Standards developed by committee STC

CB3-B - Specifications and Standards Associated with Solders and Soldering
EIA/IS-46 - Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices
EIA-402 - Liquid Rosin Fluxes (ANSI/EIA-402-73) (R79) (R86)
EIA-534 - Applications Guide, Soldering and Solderability Maintenance of Leaded Electronic Components (ANSI/EIA-534-88)
EIA-638 - Surface Mount Solderability Test (ANSI-EIA-638-95)
J-STD-001B - Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002A - Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires
J-STD-003 - Solderability Tests for Printed Boards
J-STD-004 - Requirements for Soldering Fluxes
J-STD-005 - Requirements for Soldering Paste
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders for Electronic Soldering Applications
J-STD-012 - Implementation of Flip Chip and Chip Scale Technology
J-STD-013 - Implementation of Ball Grid Array and Other High Density Technology
J-STD-026 - Semiconductor Design Standard for Flip-Chip Applications
J-STD-028 - Performance Standard for Flip Chip /Chip Scale Bumps