TIA Standards - Solid State Technology

EIA JESD22 Series - Solid State Devices, Testing Quality and Reliability
EIA JESD24 Series - Power Transistors
EIA/JESD76 - Description of 1.8 V CMOS Logic Devices
EIA-236-C - Color Coding of Discrete Semiconductor Devices (ANSI/EIA-236-C-86) (R95)
EIA-282-A - Standard for Silicon Rectifier Diodes (ANSI/EIA-282-A-1989)
EIA-284-A - Test Methods for the Collector-Base Time Constant and for the Resistive Part of the Common-Emitter Input Impedance
EIA-286-A - Standard for Measuring Forward Switching Characteristics of Semiconductor Diodes (ANSI/EIA-286-A-1991)
EIA-302 - Ranges and Conditions for Specifying Beta for Low Power Audio Frequency Transistors for Entertainment Service
EIA-306 - Measurement of Small-Signal HF, VHF, and UHF Power Gain of Transistors
EIA-307 - Voltage Regulator Diode Noise Voltage Measurement (ANSI/EIA-307-65) (R81) ( R91)
EIA-308-A - Preparation of Outline Drawings of Solid-State Products for JEDEC Type Registration
EIA-311-A - Measurement of Transistor Noise Figure at MF, HF, and VHF
EIA-313-B - Thermal Resistance Measurements of Conduction Cooled Power Transistors
EIA-318-B - Measurement of Reverse Recovery Time for Semiconductor Signal Diodes (ANSI/EIA-318-B-1996) (July 1996)
EIA-320-A - Conditions for Measurement of Diode Static Parameters
EIA-321-C - Numbering of Like-Named Terminal Functions in Semiconductor Devices and Designation of Units in Multiple-Unit Semiconductor Devices (ANSI/EIA-321-C-87) (R95)
EIA-323 - Air-Convection-Cooled, Life Test Environment for Lead-Mounted Semiconductor Devices
EIA-340 - Standard for the Measurement of |Cre|
EIA-353 - The Measurement of Transistor Noise Figure at Frequencies up to 20 kHz by Sinusoidal Signal-Generator Method
EIA-354 - The Measurement of Transistor Equivalent Noise Voltage and Equivalent Noise Current at Frequencies of up to 20 kHz
EIA-365 - Performance Test Procedure for Solar Cells and Calibration Procedure for Solar Cell Standards for Space Vehicle Service
EIA-370-B - Designation System for Semiconductor Devices (ANSI/EIA-370-B-92) (R95)
EIA-371 - The Measurement of Small-Signal VHF-UHF Transistor Short-Circuit Forward Current Transfer Ratio
EIA-372 - The Measurement of Small-Signal VHF-UHF Transistor Admittance Parameters
EIA-381-A - Method of Diode "Q" Measurement (ANSI/EIA-381-A-1992)
EIA-390-A - Standard Test Procedure for Noise Margin Measurements for Semiconductor Logic Gating Microcircuits
EIA-397 - Recommended Standard for Thyristors
EIA-397-1 - Addendum No. 1 to EIA-397
EIA-398 - Measurement of Small Values of Transistor Capacitance
EIA-419-A - Standard List of Values to Be Used in Semiconductor Device Specifications and Registration Format
EIA-435 - Standard for the Measurement of Small-Signal Transistor Scattering Parameters
EIA-471 - Symbol and Label for Electrostatic Sensitive Devices
EIA-482-A - List of Preferred Values for Use on Various Types of Small-Signal and Regulator Diodes
EIA-531 - Thermal Resistance Test Method for Signal and Regulator Diodes (Forward Voltage, Switching Method) (ANSI/EIA-531-86)
EIA-557-A - Statistical Process Control Systems (ANSI/EIA-557-A-95)
EIA-599-A - National Electronic Process Certification Standard (ANSI/EIA-599-A-98)
EIA-623 - Procurement Quality of Solid State Components by Government Contractors
EIA-659 - Failure-Mechanism-Driven Reliability Monitoring (ANSI/EIA-659-96) (Supersedes JESD29-A)
EIA-670 - Quality System Assessment (ANSI/EIA-670-97)
EIA-671 - Component Problem Analysis and Corrective Action Requirements (ANSI/EIA-671-96)
JEB15 - Terminology and Methods of Measurement for Bistable Semiconductor Microcircuits
JEB19 - Recommended Characterization of MOS Shift Registers
JEB5-A - Methods of Measurement for Semiconductor Logic Gating Microcircuits
JEP101-C - JEDEC Requirements for Class B Microcircuits
JEP103-A - Suggested Product-Documentation Classifications and Disclaimers
JEP104-A - Reference Guide to Letter Symbols for Semiconductor Devices
JEP105 - Guideline for the Characterization of Hybrid Polymeric Materials
JEP107 - Test Method for Qualification and Acceptance of Particle Getters for Use in Hybrid Microelectronic Applications
JEP109-C - General Requirements for Distributors of Military Semiconductor Devices
JEP110 - Guidelines for Measurement of Thermal Resistance of GaAs FETs
JEP112 - Test Method for Qualification and Acceptance of Circuit Support Film for Use in Microelectronic Applications
JEP113-B - Symbols and Labels for Moisture-Sensitive Devices
JEP114 - Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training and Certification
JEP115 - Power MOSFET Electrical Dose Rate Test Method
JEP116 - CMOS Custom Design Guidelines
JEP118 - Guidelines for GaAs MMIC and FET Life Testing
JEP119 - A Procedure for Executing SWEAT
JEP120 - Index of Terms Defined in JEDEC Publications
JEP120-A - Index of Terms and Abbreviations Defined in JEDEC Publications
JEP121 - Guidelines for MIL-STD-883 Screening and QCI Optimization
JEP122 - Failure Mechanisms and Models for Silicon Semiconductor Devices
JEP123 - Guideline for Measurement of Electronic Package Inductance and Capacitance Model Parameters
JEP124 - Rescinded November, 1999. superceded by J-STD-033.
JEP126 - Guideline for Developing and Documenting Package Electrical Models Derived from Computational Analysis
JEP128 - Guide for Standard Probe Pad Sizes and Layouts for Wafer-Level Electrical Testing
JEP130 - Guidelines for Packing and Labeling of Integrated Circuits in Unit Container packing
JEP131 - Process Failure Mode and Effects Analysis (FMEA)
JEP132 - Process Characterization Guideline
JEP133 - Guide for the Production and Acquisition of Radiation-Hardness Assured Multichip Modules and Hybrid Microcircuits
JEP134 - Guidelines for Preparing Consumer-Supplied Background Information Relating to a Semiconductor-Device Failure Analysis
JEP136 - Signature Analysis
JEP137 - Common Flash Interface (CFI) Codes
JEP138 - User Guidelines for IR Thermal Imaging Determination of Die Temperature
JEP64 - Solid State Product Registration List (order from Type Administration Office)
JEP65 - Test Procedures for Verification of Maximum Ratings of Power Transistors
JEP69-B - Preferred Lead Configuration for Field-Effect Transistors
JEP70-B - Quality and Reliability Standards and Publications
JEP74 - Standard List of Values to Be Used in Power Transistor Device Registration and Minimum Differences for Discreteness of Registrations
JEP78 - Relative Spectral Response Curves for Semiconductor Infrared Detectors
JEP79 - Life Test Methods for Photoconductive Cells
JEP84 - Recommended Practice for Measurement of Transistor Lead Temperature
JEP95 - JEDEC Registered and Standard Outlines for Solid State and Related Products
JES2 - Transistor, Gallium Arsenide Power FET, Generic Specification
JESD1 - Leadless Chip Carrier Pinouts Standardized for Linears
JESD10 - Low Frequency Power Transistors
JESD100-B - Terms, Definitions, and Letter Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits
JESD11 - Chip Carrier Pinouts Standardized for CMOS 4000, HC and HCT Series of Logic Circuits
JESD12 - Semicustom Integrated Circuits (Formerly Published as Standard for Gate Array Benchmark Set)
JESD12 Series - CMOS Semicustom Integrated Circuits
JESD12-1B - Addendum No. 1 to JESD12 - Terms and Definitions for Gate Arrays and Cell-Based Integrated Circuits
JESD12-2 - Addendum No. 2 to JESD12 - Standard for Cell-Based Integrated Circuit Benchmark Set
JESD12-3 - Addendum No. 3 to JESD12 - CMOS Gate Array Macrocell Standard
JESD12-4 - Addendum No. 4 to JESD12 - Method of Specification of Performance Parameters for CMOS Semicustom Integrated Circuits
JESD12-5 - Addendum No. 5 to JESD12 - Design for Testability Guidelines
JESD12-6 - Addendum No. 6 to JESD12 - Interface Standard for Semicustom Integrated Circuits
JESD13-B - Standard Specification for Description of "B" Series CMOS Devices
JESD14 - Semiconductor Power Control Modules
JESD16-A - Assessment of Average Outgoing Quality Levels in Parts Per Million (PPM)
JESD18-A - Standard for Description of Fast CMOS TTL Compatible Logic
JESD2 - Digital Bipolar Logic Pinouts for Chip Carriers
JESD20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices
JESD21-C - Configurations for Solid-State Memories
JESD22-A100-A - Cycled Temperature Humidity Bias Life Test
JESD22-A100-B - Cycled Temperature-Humidity-Bias Life Test
JESD22-A101-B - Steady-State Temperature Humidity Bias Life Test
JESD22-A102-B - Accelerated Moisture Resistance Unbiased Autoclave
JESD22-A103-A - High Temperature Storage Life
JESD22-A104-A - Temperature Cycling
JESD22-A105-B - Test Method A105-B, Power and Temperature Cycling
JESD22-A106-A - Thermal Shock
JESD22-A107-A - Salt Atmosphere
JESD22-A108-A - Bias Life
JESD22-A109 - Hermeticity
JESD22-A110-B - Test Method A110-B Highly Accelerated Temperature and Humidity Stress Test (HAST)
JESD22-A113-B - Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
JESD22-A114-A - Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)
JESD22-A115-A - Test Method A115, Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)
JESD22-A117 - Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test
JESD22-B - superceded by JESD22-A100-A through JESD22-C101.
JESD22-B100-A - Physical Dimensions
JESD22-B101 - External Visual
JESD22-B102-C - Solderability
JESD22-B103-A - Vibration, Variable Frequency
JESD22-B104-A - Mechanical Shock
JESD22-B105-B - Test Method B105-B Lead Integrity
JESD22-B106-B - Test Method B106-B Resistance to Soldering Temperature for Through-Hole Mounted Devices
JESD22-B107-A - Marking Permanency
JESD22-B108 - Coplanarity Test for Surface Mount Semiconductor Devices
JESD22-B116 - Wire Bond Shear Test
JESD22-C101 - Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components
JESD23 - Test Methods and Character Designation for Liquid Crystal Devices
JESD24 - Power MOSFETs
JESD24-1 - Addendum No. 1 to JESD24 - Method for Measurement of Power Device Turn-Off Switching Loss
JESD24-10 - Addendum No. 10 to JESD24 - Test Method for Measurement of Reverse Recovery Time trr for Power MOSFET Drain-Sources Diodes
JESD24-11 - Addendum No. 11 to JESD24 - Power MOSFET Equivalent Series Gate Resistance Test Method
JESD24-2 - Addendum No. 2 to JESD24 - Gate Charge Test Method
JESD24-3 - Addendum No. 3 to JESD24 - Thermal Impedance Measurements for Vertical Power MOSFETs (Delta Source-Drain Voltage Method)
JESD24-4 - Addendum No. 4 to JESD24 - Thermal Impedance Measurements for Bipolar Transistors (Delta Base-Emitter Voltage Method)
JESD24-5 - Addendum No. 5 to JESD24 - Single Pulse Unclamped Inductive Switching (UIS) Avalanche Test Method
JESD24-6 - Addendum No. 6 to JESD24 - Thermal Impedance Measurements for Insulated Gate Bipolar Transistors
JESD24-7 - Addendum No. 7 to JESD24 - Commutating Diode Safe Operating Area Test Procedure for Measuring dv/dt During Reverse Recovery of Power Transistors
JESD24-8 - Addendum No. 8 to JESD24 - Method for Repetitive Inductive Load Avalanche Switching
JESD24-9 - Addendum No. 9 to JESD24 - Short Circuit Withstand Time Test Method
JESD25 - Measurement of Small-Signal Transistor Scattering Parameters (Reaffirmed: April, 1999)
JESD26-A - General Specification for Plastic Encapsulated Microcircuits for Use in Rugged Applications
JESD27 - Ceramic Package Specification for Microelectronic Packages
JESD28 - A Procedure for Measuring N-Channel MOSFET Hot-Carrier-Induced Degradation at Maximum Substrate Current Under DC Stress
JESD282-B - Silicon Rectifier Diodes
JESD286-B - Standard for Measuring Forward Switching Characteristics of Semiconductor Diodes
JESD30-B - Descriptive Designation System for Semiconductor-Device Packages
JESD31 - General Requirements for Distributors of Commercial Semiconductor Devices
JESD32 - Standard for Chain Description File
JESD33-A - Standard Method for Measuring and Using the Temperature Coefficient of Resistance to Determine the Temperature of a Metallization Line
JESD34 - Failure-Mechanism-Driven Reliability Qualification of Silicon Devices
JESD35 - Procedure for the Wafer-Level Testing of Thin Dielectrics
JESD35-1 - Addendum No. 1 to JESD35 - General Guidelines for Designing Test Structures for the Wafer-Level Testing of Thin Dielectrics
JESD35-2 - Addendum No. 2 to JESD35 - Test Criteria for the Wafer-Level Testing of Thin Dielectrics
JESD36 - Standard for Description of Low-Voltage TTL-Compatible, 5 V-Tolerant CMOS Logic Devices
JESD37 - Standard Lognormal Analysis of Uncensored Data, and of Singly Right-Censored Data Utilizing the Persson and Rootzen Method
JESD38 - Standard for Failure Analysis Report Format
JESD3-C - Standard Data Transfer Format Between Data Preparation System and Programmable Logic Device Programmer
JESD4 - Definition of External Clearance and Creepage Distances of Discrete Semiconductor Packages for Thyristors and Rectifier Diodes
JESD41 - Reverse Recovery Characteristics of Silicon Diodes
JESD45 - Measurement Method for Thermal Resistance of Bridge Rectifier Assemblies
JESD46-A - Guidelines for User Notification of Product/Process Changes by Semiconductor Suppliers
JESD47 - Stress-Test-Driven Qualification of Integrated Circuits
JESD48 - Product Discontinuance
JESD49 - Procurement Standard for Known Good Die (KGD)
JESD5 - Measurement of Temperature Coefficient of Voltage Regulator Diodes
JESD50 - Special Requirements for Maverick Product Elimination
JESD51 - Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
JESD51-1 - Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
JESD51-2 - Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3 - Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-4 - Thermal Test Chip Guideline (Wire Bond Type Chip)
JESD51-5 - Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
JESD51-6 - Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
JESD52 - Standard for Description of Low Voltage TTL-Compatible CMOS Logic Devices
JESD53 - Management of Component Obsolescence by Government Contractors
JESD54 - Standard for Description of 54/74ABTXXX and 74BCXXX TTL-Compatible BiCMOS Logic Devices
JESD55 - Standard for Description of Low-Voltage TTL-Compatible BiCMOS Logic Devices
JESD57 - Test Procedures for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy Ion Irradiation
JESD59 - Bond Wire Modeling Standard
JESD6 - Measurement of Small Values of Transistor Capacitance (Reaffirmed April 1999)
JESD60 - A Procedure for Measuring P-Channel MOSFET Hot-Carrier-Induced Degradation at Maximum Gate Current Under DC Stress
JESD61 - Isothermal Electromigration Test Procedure
JESD62 - Outlier Identification and Management System for Electronic Components
JESD625-A - Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
JESD63 - Standard Method for Calculating the Electromigration Model Parameters for Current Density and Temperature
JESD64 - Standard for Description of 2.5 V CMOS Logic Devices with 3.6 V CMOS Tolerant Inputs and Outputs
JESD65 - Definition of Skew Specifications for Standard Logic Devices
JESD659-A - Failure-Mechanism-Driven Reliability Monitoring
JESD66 - Transient Voltage Suppressor Standard for Thyristor Surge Protective Device Rating Verification and Characteristic Testing
JESD67 - I/O Drivers and Receivers with Configurable Communication Voltage, Impedence, and Receiver Threshold
JESD671-A - Component Quality Problem Analysis and Corrective Action Requirement (Including Administrative Quality Problems)
JESD68 - Common Flash Interface (CFI)
JESD69 - Information Requirements for the Qualification of Silicon Devices
JESD70 - 2.5 V BiCMOS Logic Device Family Specification with 5 V Tolerant Inputs and Outputs
JESD71 - Standard Test and Programming Language (STAPL)
JESD73 - Description of 5 V Bus Switch Devices with TTL-Compatible Control Inputs
JESD74 - Early Life Failure Rate Calculation Procedure for Electronic Components
JESD75 - Ball Grid Array Pinouts Standardized for 32-Bit Logic Functions
JESD76 - Description of 1.8 V CMOS Logic Devices
JESD77-A - Terms, Definitions, and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices
JESD77-B - Terms, Definitions, and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices
JESD78 - IC Latch-Up Test
JESD7-A - Standard for Description of 54/74HCXXXX and 54/74HCTXXXX High Speed CMOS Devices
JESD8 Series - Integrated Circuits - Gate Arrays, Low Voltage
JESD80 - Standard for Description of 2.5 V CMOS Logic Devices
JESD8-2 - Addendum No. 2 to JESD8 - Standard for Operating Voltages and Interface Levels for Low Voltage Emitter-Coupled Logic (ECL) Integrated Circuits
JESD8-3 - Addendum No. 3 to JESD8 - Gunning Transceiver Logic (GTL) Low-Level, High-Speed Interface Standard for Digital Integrated Circuits
JESD8-4 - Addendum No. 4 to JESD8 - Center-Tap-Terminated (CTT) Low-Level, High-Speed Interface Standard for Digital Integrated Circuits
JESD8-5 - Addendum No. 5 to JESD8 - 2.5 V +/- 0.2 V (Normal Range), and 1.8 V to 2.7 V (Wide Range) Power Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuit
JESD8-6 - Addendum No. 6 to JESD8 - High Speed Transceiver Logic (HSTL) - Standard for Digital Integrated Circuits
JESD8-7 - 1.8 V +- 0.15 V (Normal Range), and 1.2 - 1.95 V (Wide Range) Power Supply Voltage and Interface Standard for Non-Terminated Digital Integrated Circuit
JESD8-8 - Addendum No. 8 to JESD8 - Stub Series Terminated Logic for 3.3 Volts (SSTL_3), A 3.3 V Voltage based interface standard for digital integrated circuits
JESD8-9 - Addendum No. 9 to JESD8 - Stub Series Terminated Logic for 2.5 Volts (SSTL_2)
JESD8-A - Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits
JESD8-B - Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits
JESD95-1 - Rescinded - incorporated into JEP-95
JESD99 - Glossary of Microelectronic Terms, Definitions, and Symbols
JESD99-1 - Addendum No. 1 to JESD99 - Terms, Definitions, and Letter Symbols for Analog-to-Digital and Digital-to-Analog Converters
JESD99-A - Terms, Definitions, and Letter Symbols for Microelectronic Devices
JESD9-A - Metal Package Specification for Microelectronic Packages and Covers
J-STD-020-A - Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
J-STD-033 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
J-STD-035 - Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
TENTSTD12 - Standard for Selenium Surge Suppressors